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| product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/36 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? 14? 001 sound processors for home theater systems 7.1ch sound processor for high-quality audio with built-in micro-step volume BD34704KS2 general description the BD34704KS2 is an 8ch independent volume system realized high-quality sound by improved specification of op-amp and optimized layout of the element.the system is designed to allow 7.1ch surround system application. micro-step volume can reduce the switching pop noise during volume attenuation, so a high quality audio system could be achieved. this ic is available 12ch single-end input selectors to maximum 3 zones. and also available 2 system multi input selector. features ? 12ch input selectors (it is extendable to up to 18 in case of no use other functions such as multi input, rec output and sub output) ? micro-step volume can reduce the switching pop noise during volume attenuation ? zone 3 is supported ? 2ch sub-volume for zone output that is available for independent control with a micro step function ? 2-wire serial bus control, corresponding to 3.3/5v applications ? suitable for the av receivers, home theater systems, etc key specifications ? total harmonic distortion: 0.0004%(typ) ? maximum output voltage: 4.2vrms(typ) ? output noise voltage: 1.2 vrms(typ) ? residual output noise voltage: 1.0 vrms(typ) ? cross-talk between channels: -105db(typ) ? cross-talk between selectors: -105db(typ) package w(typ) x d(typ) x h(max) sqfp-t80c 16.00mm x 16.00mm x 1.60mm sqfp-t80c typical application circuit figure 1. application circuit datashee t
2/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 3/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 4/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 5/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 6/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 7/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 8/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 9/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? cl 10/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? ? ? ? ? 11/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 12/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 13/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 14/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 15/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 16/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 17/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 18/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 19/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 20/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 21/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? 22/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? w switching time (tsoft) [ab switching time] =tsft [ba switching time] =tsft [wait time] =twait current xdb send ydb change ydb b a a b 23/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? 15 ? 001 micro step volume circuit 1. micro step volume technology. 1-1. micro step volume effects. micro step volume is rohm original switching pop noise prevention technology. the audible signal is discontinuous during the gain switching instantly which cause the noise to occu r. this micro step volume will prevent this discontinuous signal by completing the signal waveform and will significantly reduce the noise. figure 12. micro step volume waveform this micro step volume will start the switchin g when received the signal sent from the micon. at any constant time, the switching waveform is shown as above figure. this ic will optimally operates by internally processes the data sent from the mic on to prevent the switching shock. however, sometimes the switching waveform is not lik e the intended form depends on the transmission timing. therefore, below is the example of t he relationship between the transmission timing and actual switching time. please consider this relationship for the setting. 1-2. micro step volume application target block ? micro step volume application target bloc ks are 7.1ch volume and sub volume. dc fl uctuat i o n control signal micro step volume waveform if the gain instantly changes after the dat a is transmitted, the dc fluctuation will occur as much as before and after the oscillation different. this technology makes this fluctuation changes slow. 24/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? w switching time (tsoft) [ab switching time] =tsft [ba switching time] =tsft [wait time] =twait current xdb send ydb change ydb b a a b serial data switching time w (fl 0db) (fl -db) tsoft * 1.4 msec fl output w b a a b b a a b serial data switching time (fl 0db) (fl -db) fl output w b a a b b a a b 25/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? serial data switching time w b a a b b a a b ? ? invalid data output initial initial ? ? serial data switching time w b a a b ? output fl initial initial t - twait output fr initial initial fl fr serial data switching time w b a a b ? output fl initial initial t - twait output fr initial initial b a a b fl fr 26/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? serial data switching time w (fl 0db) (sw 0db) fl output b a a b b a a b (sl 0db) b a a b fl switching time sw switchi ng time sl switching time sw output sl output fl fr sw c sl sr sbl sbr subl subr rch lch state1 state2 state3 state4 state5 27/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? switching time ? output fl initial initial output sw initial w b a a b b a a b b a a b ? fl -6db fl -20db sl -6db sw -6db fl switching time sw switch time sl switching time fl switching time b a a b initial ? output sl initial initial serial data switching time w (fl 0db) (sw 0db) b a a b b a a b fl switching time sw switching time (fl 0db) same data serial data 28/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? application circuit diagram figure 17. application circuit diagram notes on wiring 1. gnd has to be wired from reference point and it should be thick. setting error occur by common impedance on gnd line to be big in case of big attenuation setting. 2. wiring pattern of cl and da shall be away from the analog unit and cross-talk is not acceptable. 3. if possible, lines of cl and da are not parallel. if they are adjacent to each other, the lines should be shielded. 4. please concentrate on wiring pattern of the input terminal for input selector to the crosstalk. it is recommended that it is shielded during wiring period. 5. please connect the decoupling capacitor of the power supply in the shortest distance as much as possible to vcc and gnd, vee. 29/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? power dissipation thermal design for the ic temperature has great influence to the ic characteristics, and exceeding the absolute maximum ratings may degrade and damage the ic. a proper consideration must be given fr om two points, immediate damage and long-term reliability of operation. figure 18. temperature derating curve (note) values mentioned above are based on actual measurement, and not guaranteed. power dissipation value varies depending to the board on which the ic is mounted. reference data sqfp-t80c 2.0 1.0 0.0 0 25 50 75 100 125 150 ambient temperature ta(c) power dissipation pd(w) 1.75w measurement condition: rohm standard board board size ? 30/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? i/o equivalence circuit(s) terminal number terminal name terminal voltage (v) equivalent circuit terminal description 21 31/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? ? ? ? vcc vee vee vcc 32/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. vee voltage ensure that no pins are at a voltage below that of the vee pin at any time, even during transient condition. 4. ground wiring pattern gnd pins which are digital ground(4pin) and analog gro und(21-27,32,39,59,70,73-79pin) are not connected inside lsi. these ground pins traces should be routed separately but connected to a single ground at the reference point of the application board. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as shor t and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guar anteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to ic pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly a nd use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals because the input impedance of the terminal becomes 100k ? 33/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? operational notes ? continued 1 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when vee > pin a and vee > pin b, the p-n junction operates as a parasitic diode. when vee > pin b, the p-n junction oper ates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the vee voltage to an input pin (and thus to the p substrate) should be avoided. figure 19. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. about power on/off 1. at power on/off, a pop sound will be generated and, therefore, use mute on the set. 2. when turning on power supplies, vee and vcc shoul d be powered on simultaneously or vee first; then followed by vcc.(tdelay should be vee= 35/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? physical dimension, tape and reel information package name sqfp-t80c aaaaaaaaaa ? order quantity needs to be multiple of the minimum quantity. 36/36 datasheet d a t a s h e e t BD34704KS2 tsz02201-0c2c0e100210-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.2.25 rev.002 www.rohm.com tsz22111 ? ? revision history date revision changes 7.nov.2014 001 new release 25.feb.2015 002 add micro-step volume specification datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. datasheet part number BD34704KS2 package sqfp-t80c unit quantity 500 minimum package quantity 500 packing type tray constitution materials list inquiry rohs yes BD34704KS2 - web page distribution inventory |
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